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"Modeling and Optimization of Electronic PCB/Packaging Structures for Signal and Power Integrity"
Free 45 minute webcast presentation
Thursday Oct 14, 2PM ET
Please join us for this online event which will demonstrate, with the help of various PCB and package examples, how 3D simulation is becoming an essential part of signal and power integrity flows. In addition a new backend simulation feature of Cadence tools will be described where the layout engineer stays in his familiar environment and the 3D simulation runs in the background.
More details and registration available at:
www.cst.com/webinars
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Веб семинар по CST
Oct 13 2010, 07:36
