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> Новая версия пакета CST STUDIO SUITE 2011 позволит более точно моделировать кабельные системы
Yuri Potapoff
сообщение Aug 16 2010, 11:47
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Уважаемые господа!

Компания CST сообщила о дальнейшем развитии своих продуктов,
нацеленных улучшение качества анализа при решении задач
электромагнитной совместимости. В новой версии пакета CST STUDIO SUITE
2011 будет реализована более тесная интеграция между модулями CST
CABLE STUDIO (CST CS) и CST MICROWAVE STUDIO (CST MWS), включающим
вычислительное ядро TLM (Microstripes).

В рамках единой среды проектирования ряд новых моделей ("compact
aperture models", "thin panel" и "absorbing panel") позволят более
точно описывать импортированную из 3D CAD системы структуру кабельного
жгута и выполнять анализ паразитных излучений и воздействие внешнего
поля на проводники во временной области. Использование 3D EM
моделирования позволит обсчитывать сложные кабельные конструкции,
например, включающие экранированные витые пары.

Выпуск новой версии пакета CST STUDIO SUITE 2011 намечен на январь
2011 года.

Более подробную информацию о продуктах компании CST можно найти по
адресу:

http://www.eurointech.ru/cst

За любой дополнительной информацией просим обращаться по адресу
sales@eurointech.ru или телефону (495) 749-45-78 в компанию Евроинтех,
являющуюся официальным дистрибьютором программного обеспечения
CST на территории России и стран СНГ.
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Yuri Potapoff
сообщение Sep 3 2010, 07:00
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Кому интересно: осенняя серия веб семинаров CST.

http://www.cst.com/Content/Events/webinars.aspx


CST is excited to announce a new series of technical webinars focusing on the major benefits of full wave simulation to the high frequency/high speed design process. We'll be looking at challenging applications and how advances in numerical techniques and computing technology have enabled fast turnaround and significantly reduced prototyping costs.

CST Webinars are free to attend.

Multiband Wireless Device Design in a Complex Physical Environment

Efficeint Time domain simulation of very complex compact devices with multiple materials and human body proximity.

■Location: Worldwide
■Date: 9 Sep 2010
■Time: 2PM Eastern, 11 AM Pacific
■Duration: 45 Minutes
■Register here

Using a real world example of a "super smartphone", this presentation will show how CST's simulation technology is ideally suited to import and simulation of a compact wireless device. It will show how the software can help with microwave, RF and high data rate design and significantly reduce expensive prototype testing. It will also show how human body interaction is modeled and accurate SAR values can be delivered. Presentation 40 minutes followed by Q&A

Modeling Susceptibility of Large Airborne or Ground Based Structures to Lightning

Making use of specialized solver capabilites such as diffusion modeling, cable harness simulation and "compact models" to efficiently model effects of slow lightling transients on large structures.

■Location: Worldwide
■Date: 23 Sep 2010
■Time: 2PM Eastern, 11 AM Pacific
■Duration: 45 Minutes
■Register here

This presentation will look at the fundamentals of the lightning stroke and it’s direct and indirect affects on exposed structures made of varying materials. It will show how CST’s TLM solver is ideally suited to simulating the complete pulse on a typically large structure and correctly identifying the current paths and potential damge mechanisms. Various examples will be shown of how simulation data can help identify problem areas and potential protection measures.

Modeling and Optimization of Electronic PCB/Packaging Structures for Signal and Power Integrity

Using advanced layout import and complete solver technology to characterize the signal throughput and power distribution on PCBs and packages.

■Location: Worldwide
■Date: 14 Oct 2010
■Time: 2PM Eastern, 11 AM Pacific
■Duration: 45 Minutes
■Register here

CST Microwave Studio makes working with complex PCBs and packages easy. It has powerful import filters for proprietary layout formats such as Cadence Allegro and Sip SI, as well as interchange formats such as ODB++, Gerber and DXF. The filters allow an engineer to directly import a full package or PCB, verify the stack up, materials and components and then extract the nets or areas of interest into the 3D environment This presentation will show how 3D simulation is becoming an essential part of the signal and power integrity workflow. Various PCB and package examples will be shown and a new backend simulation feature of Cadence tools will be described where the layout engineer stays in his familiar environment and the software runs 3D simulation in the background.


Modeling the Installed Performance of Antennas in a Ship Topside Environment

Taking the output from one simulation to drive another and making use of scaleable solver technology allows geometrically very large and complex installed performance simulation.

■Location: Worldwide
■Date: 4 Nov 2010
■Time: 2PM Eastern, 11 AM Pacific
■Duration: 45 Minutes
■Register here

CST has introduced new solving technology that pushes the limits of what’s possible in 3D simulation. Using this technology it is now possible to simulate something as large as a frigate with multiple topside mounted antenna with reasonable compute resources. Critically, simulations can coupled so that the output of an antenna simulated in isolation with say, general frequency domain (F), can drive a much larger structure in the well suited asymptotic solver (A). This presentation will explore these possibilities through the use of navy ship example.

CST STUDIO SUITE 2011 - What's Coming

An overview of the new features and benefits of STUDIO SUITE 2011 shipping Jan 2011

■Location: Worldwide
■Date: 9 Dec2010
■Time: 2PM Eastern, 11 AM Pacific
■Duration: 45 Minutes
■Register here
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