The width of the conductor should be as uniform as possible over its length; however, it may be necessary because of design restraints to ‘‘neck down’’ a conductor to allow it to be routed between restricted areas, e.g., between two plated-through holes. The use of ‘‘necking down’’ such as that shown in Figure 10-1, can also be viewed as ‘‘beefing up.’’ Single width, having a thin conductor throughout the board, as opposed to the thin/thick approach is less desirable from a manufacturing point of view as the larger width conductor is less rejectable due to edge defects rated as a percentage of the total width. In any event, if the conductor width change is used, the basic design requirements defined herein shall not be violated at the necking down location.
Тамже картинка это из IPC2221
В IPC 782 пункт 3.6.2.2 тоже сказано
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