интересует как это делают
покупают кристалл roic и приваривают к матрице или как?
Полная версия этой страницы: как roic имплементируют с матрицей ?
Форум разработчиков электроники ELECTRONIX.ru > Cистемный уровень проектирования > Разработка цифровых, аналоговых, аналого-цифровых ИС
Цитата(net @ Jun 9 2009, 12:06) 
интересует как это делают
покупают кристалл roic и приваривают к матрице или как?
покупают кристалл roic и приваривают к матрице или как?
Если я вообще хоть как-то понял вопрос - то в raytheon делают так:
The two elements of the sensor form a stacked structure, called a sensor chip assembly (SCA), which connects the detector array to the ROIC using a hybridization process. Although similar to the flip-chip technology used by the computer industry, hybridization requires millions of indium “bumps” to be connected on each die, one bump for each pixel fabricated on an 8-µm center, with center-to-center spacing on the order of 10 to 20 µm. During hybridization, the detector and ROIC die are positioned parallel to one another and then pressed together with a force that can exceed 200 lb. Alignment and parallelism accuracies must be better than 1 µm for all the indium bumps to make reliable electrical and physical connections. Remarkably, experienced detector manufacturers typically connect 99.99% of the indium bumps even on megapixel arrays.
Цитата(SM @ Jun 10 2009, 02:34)
Если я вообще хоть как-то понял вопрос - то в raytheon делают так:
The two elements of the sensor form a stacked structure, called a sensor chip assembly (SCA), which connects the detector array to the ROIC using a hybridization process. Although similar to the flip-chip technology used by the computer industry, hybridization requires millions of indium “bumps” to be connected on each die, one bump for each pixel fabricated on an 8-µm center, with center-to-center spacing on the order of 10 to 20 µm. During hybridization, the detector and ROIC die are positioned parallel to one another and then pressed together with a force that can exceed 200 lb. Alignment and parallelism accuracies must be better than 1 µm for all the indium bumps to make reliable electrical and physical connections. Remarkably, experienced detector manufacturers typically connect 99.99% of the indium bumps even on megapixel arrays.
The two elements of the sensor form a stacked structure, called a sensor chip assembly (SCA), which connects the detector array to the ROIC using a hybridization process. Although similar to the flip-chip technology used by the computer industry, hybridization requires millions of indium “bumps” to be connected on each die, one bump for each pixel fabricated on an 8-µm center, with center-to-center spacing on the order of 10 to 20 µm. During hybridization, the detector and ROIC die are positioned parallel to one another and then pressed together with a force that can exceed 200 lb. Alignment and parallelism accuracies must be better than 1 µm for all the indium bumps to make reliable electrical and physical connections. Remarkably, experienced detector manufacturers typically connect 99.99% of the indium bumps even on megapixel arrays.
спасибо !!!
а я ни как не мог сообразить как их соединяют и почему roic привязан к размеру пиксела
бревна то я в собственном глазу и не заметил
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