Цитата(net @ Jun 9 2009, 12:06)

интересует как это делают
покупают кристалл roic и приваривают к матрице или как?
Если я вообще хоть как-то понял вопрос - то в raytheon делают так:
The two elements of the sensor form a stacked structure, called a sensor chip assembly (SCA), which connects the detector array to the ROIC using a hybridization process. Although similar to the flip-chip technology used by the computer industry, hybridization requires millions of indium “bumps” to be connected on each die, one bump for each pixel fabricated on an 8-µm center, with center-to-center spacing on the order of 10 to 20 µm. During hybridization, the detector and ROIC die are positioned parallel to one another and then pressed together with a force that can exceed 200 lb. Alignment and parallelism accuracies must be better than 1 µm for all the indium bumps to make reliable electrical and physical connections. Remarkably, experienced detector manufacturers typically connect 99.99% of the indium bumps even on megapixel arrays.