SMD посадочные места специального назначения, 0603, 0805 и т.д. для аппаратуры класса "aerospace" - какие он Опции

[bms]

Посадочные места для SMD резисторов, конденсаторов, индуктивностей для "aerospace"-устройств отличаются ли от обычных или стандарты IPC и в этой области годятся? Речь идет о типоразмерах 0402, 0603, 0805 и т.д.

Заранее благодарен.

[OMY]

IPC-7351B standard uses a 3-Tier CAD library system:
1. Least – for cell phones and hand held devices
2. Nominal – for controlled environment desktop
3. Most – for Military and Medical applications

[bms]

IPC-7351B standard uses a 3-Tier CAD library system:
1. Least – for cell phones and hand held devices
2. Nominal – for controlled environment desktop
3. Most – for Military and Medical applications

оп-с... а можно выдержку из документа (в виде страницы, где это) написано выложить?

ну скажем на СВЧ имел ввиду я эти паттерны, вынужден свои делать, ими и пользуюсь...

склоняюсь к такому же поведению...

[vicnic]

оп-с... а можно выдержку из документа (в виде страницы, где это) написано выложить?

Если за основу взять программу PCB Matrix LP Viewer V2009 (бывшая популярная LP Viewer от PCB Libraries), то к программе есть такой комментарий по поводу используемых библиотек:

Three land pattern geometry variations are supplied for each of the device families; maximum land protrusion (Density Level A), median land protrusion (Density Level and minimum land protrusion (Density Level C). Before adapting the minimum land pattern variations the user should consider product qualification testing based on the conditions shown in Table 3-13.

• M - Density Level A: Maximum (Most) Land Protrusion – For low-density product applications, the 'maximum' land pattern condition has been developed to accommodate wave or flow solder of leadless chip devices and leaded gull- wing devices. The geometry furnished for these devices, as well as inward and “J”-formed lead contact device families, may provide a wider process window for reflow solder processes as well.

• N - Density Level B: Median (Nominal) Land Protrusion – Products with a moderate level of component density may consider adapting the 'median' land pattern geometry. The median land patterns furnished for all device families will provide a robust solder attachment condition for reflow solder processes and should provide a condition suitable for wave or reflow soldering of leadless chip and leaded gull-wing type devices.

• L - Density Level C: Minimum (Least) Land Protrusion – High component density typical of portable and hand-held product applications may consider the 'minimum' land pattern geometry variation. Selection of the minimum land pattern geometry may not be suitable for all product use categories. The use of classes of performance (1, 2, and 3) is combined with that of component density levels (A, B, and C) in explaining the condition of an electronic assembly. As an example, combining the description as Levels 1A or 3B or 2C, would indicate the different combinations of performance and component density to aid in understanding the environment and the manufacturing requirements of a particular assembly.