Взял сам стандарт: "IPC_JSTD-001C_RequirementsSolderedElecricElectronicAssemlyes.pdf" стр. 27
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Note 4. Solder fillet may extend through the top bend. Solder shall not touch package body or end seal, except for low profile SMD devices, e.g., SOICs and SOTS. Solder should not extend under the body of low profile surface mount components whose leads are made of Alloy 42 or similar metals.
IPC Footprint Wizard, Какой он IPC версии?
Dec 11 2007, 05:16
